Top Engineering Jobs in Singapore

Design and enable engineering tools and tester frameworks for NAND characterization, bring-up, debug, and failure analysis. Integrate lab instrumentation with testers, support tester workflows, collaborate with Device PE and Validation teams, and apply AI-enabled methods to accelerate test program development and diagnostics.

The role involves validating HBM designs through cross-functional collaboration, data analysis, and innovative problem-solving in a dynamic environment.

Perform die‑level electrical failure analysis for advanced NAND products, construct root‑cause failure models, design and run bench DOE and probe experiments, translate findings into test/process/device improvements, support NPI and HVM issue resolution, develop custom test conditions and scripts, and drive data‑driven yield and reliability improvements while integrating AI‑assisted tools.

Lead global OCT Photo teams and strategy for scanner and track hardware, process optimization, cost reduction, and yield improvement. Build Photo manufacturing roadmaps, manage supplier relationships, drive cross-functional projects and global expansions, oversee EUV/DUV and metrology efforts, implement equipment/material strategies, and develop workforce and future Photo engineering leaders. Integrate AI and data science for process innovation.

Lead integration strategies for semiconductor modules, develop analysis frameworks, ensure process uniformity, and drive technical alignment across global projects. Requires strong problem-solving skills and experience in fabricating semiconductor processes.

Manage Package Characterization lab operations, provide technical leadership, ensure lab readiness for new technologies, and enhance workforce development.

The Principal Engineer leads advanced photolithography development, defining technology roadmaps, mentoring engineering teams, and driving innovation for semiconductor processes.

Perform electrical device characterization, fault isolation, and physical failure analysis for qualifications, customer returns, and NPI. Root-cause defects, propose process/electrical failure mechanisms, develop new FA/fi techniques, lead CE PYE technicians, maintain high tool uptime, and integrate AI-assisted tools to improve yield and reliability.

Validate HBM design and test modes through simulation, lab and ATE analysis, root-cause manufacturing/test issues, collaborate with design, manufacturing, test and quality teams, document architecture per JEDEC, and apply data analysis and AI-enabled improvements to improve product reliability and performance.

Lead the development of reliability test flows and reduce DPM while managing cross-functional collaboration to enhance HBM product quality and efficiency.