Top Engineering Jobs in Singapore

This role involves advancing thin film process development for NAND technology through experiments, material characterization, collaboration with teams, and project leadership.

Owns pre-silicon validation, simulation regression, post-silicon characterization, and simulation-to-silicon correlation for NAND test chip vehicles. Analyzes device and architecture sensitivities, defines test methodologies, leads root-cause investigations, and drives silicon learning across design, process, technology, and test teams. The role also develops reusable technical methods, influences cross-functional decisions, mentors engineers, and applies data analytics, machine learning, and AI-assisted tools.

Supports advanced HBM package development and new product introduction by transitioning products from development through low-volume and run-at-risk manufacturing into high-volume production. Applies engineering, statistical, DOE, FMEA, risk assessment, control-plan, and corrective-action methods. Collaborates with development, manufacturing, and supplier teams globally, supports technology transfer, and uses AI-enabled tools, MES, automation, JMP, and Python to improve efficiency and quality.

Maintains and supports semiconductor process control systems, including SPC, FDC, R2R, recipe management, MES, MAM, and specification platforms. Executes approved system changes, validates automation behavior and equipment communication, monitors alarms and data integrity, troubleshoots first-line issues, and escalates abnormalities. Maintains governance documentation and collaborates with process, equipment, manufacturing, automation, and quality engineering teams. Requires the ability to work 12-hour rotating shifts.

Perform electrical characterization and failure analysis of HBM products, distinguishing package and device failures. Troubleshoot test equipment, analyze reliability data, document failure mechanisms, coordinate physical analysis, maintain FA databases, support lab users, train engineers, and review quality and reliability requests. Apply AI to improve analysis accuracy, reduce test time, and increase throughput.

The Senior Member of Technical Staff leads CMP process development for NAND technology, driving execution across teams, resolving complex issues, and mentoring engineers.

Develops semiconductor measurement recipes and inspection methods to improve product yield, quality, defect detection, and equipment performance. Uses advanced analytics, statistical process control, experiment design, sampling methodologies, and root-cause analysis to identify process and machinery deviations. Collaborates with engineering teams and tool suppliers on qualification, monitoring, maintenance optimization, and cost-reduction projects. Supports fab operations through data-driven recommendations and trains engineers on recipe maintenance, troubleshooting, recovery, and maintenance activities.

Participate in AMHS engineering discussions and cross-functional collaboration within a semiconductor manufacturing environment. Analyze manufacturing and AMHS operations using structured problem-solving, data analytics, visualization tools, and AI-enabled workflows. Identify operational improvement opportunities, develop data-driven recommendations, and present findings. The internship provides exposure to Assembly and Test operations, operational excellence, and automation systems.

Defines and implements NAND Flash reliability test flows, analyzes high-volume statistical data, performs electrical failure analysis, develops reliability countermeasures, and qualifies products. Collaborates with fabrication, technology, design, development, systems, and quality teams to prevent customer escapes. Supports customer inquiries, mentors junior engineers, leads reliability initiatives, and applies AI-assisted tools, Python, JMP, and Tableau to improve analysis and product quality.

Drive manufacturing execution and product engineering for next-generation HBM products. Responsibilities include test flow development and validation, optimized test coverage, circuit debug, yield improvement, test-time reduction, reliability enhancement, cost reduction, and design-for-test strategy. The role supports product validation using CAD tools and Verilog simulations, resolves manufacturing and quality issues, collaborates cross-functionally, mentors engineers, and makes technical decisions on risk and project priorities.