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Broadcom

Wafer Fab Process Engineer

Reposted 7 Days Ago
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In-Office
Singapore, SGP
Senior level
In-Office
Singapore, SGP
Senior level
Lead development, optimization, and transfer of wafer fabrication processes (thin-film deposition, wafer thinning, thermal processes, implantation) to meet yield, quality, cost, and reliability targets. Drive yield improvement, defect reduction, DOE/SPC experiments, root-cause analysis, and process transfer to high-volume manufacturing. Collaborate cross-functionally, mentor junior staff, and manage supplier process and material improvements.
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Job Description:

Job Summary
Lead process development, optimization, and transfer to manufacturing to achieve yield, quality, cost, and reliability targets.

Key Responsibilities

  • Own and drive advanced process modules (thin film deposition - metal/passivation, wafer thinning, thermal - oxidation, diffusion, implantation).

  • Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies.

  • Drive new process integration (NPI) and process transfer to high-volume manufacturing.

  • Perform root cause analysis and implement robust corrective/preventive actions.

  • Define process control plans, SPC strategies, and OCAP execution.

  • Collaborate cross-functionally with equipment, integration, quality, and R&D teams.

  • Mentor junior engineers and technicians.

  • Interface with suppliers on process and material improvements.

Qualifications

  • Bachelor’s or Master’s degree in Engineering (Electrical, Chemical, Materials, or related).

  • At least 5 years of semiconductor wafer fab process experience in thin film deposition - metal/passivation and/or thermal - oxidation, diffusion, implantation.

  • Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools.

  • Demonstrated leadership in cross-functional technical projects.

  • Strong analytical, problem-solving, and communication skills

Preferred

  • PhD in Engineering (Electrical, Chemical, Materials, or related).

  • Six Sigma certification (Green/Black Belt).

  • Experience supporting 4" to 6" wafer scaling or equivalent manufacturing transition.

Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Broadcom Singapore Office

Singapore

Broadcom Singapore, Singapore, SGP Office

Singapore, Singapore

Broadcom Woodlands, SGP Office

Woodlands, Singapore

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