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Micron Technology
Sr Advanced Packaging Technology Development Engineer, Bonding process
Be an Early Applicant
Develops and improves HBM bonding processes and yields for advanced semiconductor packaging. Supports chip stacking and 2.5D/3D package research, on-site technical execution, troubleshooting, root-cause analysis, documentation, and materials characterization. Coordinates global mechanical characterization, recommends test structures and vehicles, evaluates materials, and collaborates with packaging-material suppliers. Requires expertise in bonding technologies, mechanisms, and related equipment, along with cross-functional collaboration and English-Chinese fluency.
Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Specific Responsibilities:
1. Drive HBM process development and yield improvement in WSS process.
2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development
4. Support project on-site execution and make decisions as technical consultant
5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues
6. Generate internal and external documentation for presentations and technical reports
Technology Development:
1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs.
2. Project engagement with cross-team interaction, providing expert contribution in materials characterization.
3. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site.
4. Provide recommendations for test structure and test vehicle design for material property evaluation.
5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technology roadmaps.
Qualifications:
1. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields
2. Must be at least 2 years experience in BONDING related works
3. Solid understanding of WSS/BOND advanced technilogies, 1 or more in below fields:
a) Temporary bonding/debonding (TBDB)
b) Hybrid Bonding
c) Fusion Bonding / Direct wafer bonding
4. Knowledge of bonding mechanisms - surface activation, adhesion physics, interface energy, thermo-compression and plasma-assisted bonding
5. Hands-on experience with bonding-related tools is a plus, such as SUSS/EVG/TEL, etc
6. Innovative / integration mindset with independent thinking
7. Good team player with a high motivation
8. Fluent communication in both English and Chinese
AI Relevant Job Responsibilities:
- Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
- Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one's scope of work.
- Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and achieving business
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact at [email protected] .
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Specific Responsibilities:
1. Drive HBM process development and yield improvement in WSS process.
2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development
4. Support project on-site execution and make decisions as technical consultant
5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues
6. Generate internal and external documentation for presentations and technical reports
Technology Development:
1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs.
2. Project engagement with cross-team interaction, providing expert contribution in materials characterization.
3. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site.
4. Provide recommendations for test structure and test vehicle design for material property evaluation.
5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technology roadmaps.
Qualifications:
1. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields
2. Must be at least 2 years experience in BONDING related works
3. Solid understanding of WSS/BOND advanced technilogies, 1 or more in below fields:
a) Temporary bonding/debonding (TBDB)
b) Hybrid Bonding
c) Fusion Bonding / Direct wafer bonding
4. Knowledge of bonding mechanisms - surface activation, adhesion physics, interface energy, thermo-compression and plasma-assisted bonding
5. Hands-on experience with bonding-related tools is a plus, such as SUSS/EVG/TEL, etc
6. Innovative / integration mindset with independent thinking
7. Good team player with a high motivation
8. Fluent communication in both English and Chinese
AI Relevant Job Responsibilities:
- Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
- Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one's scope of work.
- Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and achieving business
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact at [email protected] .
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
Micron Technology Singapore, Singapore, SGP Office
1 Woodlands Ind Park D St 1, Singapore, Singapore, 738799
Micron Technology Singapore, Singapore, SGP Office
1 N Coast Dr, Singapore , Singapore, Singapore, 757432
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