Senior Manager, Heterogeneous Integration Group(HIG), High Bandwidth Memory(HBM), Package PE

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

JR71897 Senior Manager, Heterogeneous Integration Group(HIG), High Bandwidth Memory(HBM), Package PE

As a Senior Manager of HIG HBM Package PE, you will lead and develop a high-performing team to driving Package PE activities within the HBM Systems and Product Engineering Team. You will lead a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale.  You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization.

Key Responsibilities

Leadership Responsibilities

• Leadership Development: By coaching and providing career development, this role ensures the growth of future leaders in the semiconductor industry, which is vital for driving innovation and technological advancement.

• Skill Enhancement: The role involves identifying strengths and creating specific development plans to improve skills. This continuous skill enhancement is crucial to keep up with the rapidly evolving technology landscape.

• Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization.

• Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.

• Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.

• Product Alignment: Managing technical projects to align product performance and manufacturing flows across HBM products ensures consistency and high quality in the production process, which is key to the successful implementation of current and upcoming technology.

• Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.

Technical Responsibilities

• Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process.

• Accountable for driving down the HBM Cube on Wafer Assembly Yield Loss which is seen as part of the Manufacturing Line Yield Pareto through optimized test coverage and collaborating with the Technology Development and Packaging organizations.

• Driving Cumulative Yield Ownership with cross functional teams and drive initiatives for overall Yield and Quality Improvement.

• Qual/Package Qual and RMA Packaging Related Issues

• Front End and Back End Process Conversions: Work with FAB, TD, APTD, PDE Teams to establish a robust Process Conversion Business Process to facilitate Yield Improvement, DPM Improvement and overall performance of HBM Products

• Data Analysis for Yield Improvement and Reliability: Utilizing in-house statistical tools/machine learning/AI for engineering data analysis to improve yields and reliability and implement within the Dispo workflow.

• Create a deviation alert system for yield loss, char/param trend, wafer/die/cube shading

Requirements

• Bachelors/Masters Electrical Engineering Degree with 8+ years of experience in the semiconductor industry.

• Demonstrating Strong Leadership Skills and Technical Skills

• Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.

• Strong sense of responsibility and accountability towards assigned role with professional work ethic.

• Work on site in Taiwan with international travel to USA

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact [email protected]

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.