Boschman Advanced Packaging Technology is a high-tech, engineering-driven company based in the Netherlands, specializing in advanced back-end semiconductor packaging solutions. We offer a unique one-stop-shop concept, providing services from package development to industrialization, including Package Development Services, Assembly & Test Services, and Industrial Equipment. Our focus areas include Power Electronics (Automotive, Smart Grid, Industrial), MEMS, and Sensors, in line with the Global Energy Transformation and Electric Revolution.
Responsibilities:
Organize and prepare technically sound proposals for customers, including sales materials, technical specifications, and quotations.
Translate customer requirements into technical and mechanical system solutions, advising on equipment configuration and application solutions.
Act as a technical sparring partner for customers, focusing on mechanical design and machine architecture.
Collaborate with internal Engineering, R&D, and Project teams to ensure proposed solutions align with Boschman product platforms.
Support the commercial team in the Asia Pacific region, identifying and developing new business opportunities.
Contribute to defining machine concepts, layouts, and customizations from a mechanical engineering perspective.
Build and maintain long-term customer relationships, ensuring satisfaction and business growth.
Administer sales funnel and forecasts, travel to meet customers, and represent Boschman at industry events.
Join us in a dynamic and enthusiastic working environment that values flexibility, drive, and initiative. Our culture is involved, innovative, and solution-driven, offering employees the freedom to take on responsibility. This role reports to the General Manager in Singapore.
Job Offer RequirementsThank you for your interest in the position. Below are the requirements for the job opening:
MSc or BSc degree in Mechanical Engineering (mandatory).
Minimum of 5 years of experience in a technical-commercial role, preferably within high-tech or semiconductor equipment industries.
Solid hands-on knowledge of mechanical engineering for complex production equipment, such as:
Industry norms and standards
Machine architecture and module concepts
Strong understanding of equipment design principles for semiconductor back-end manufacturing, preferably for molding and/or sintering related processes.
Proven ability to review and challenge customer specifications, mechanical concepts, and system configurations independently and translate these into customer-ready solutions.
Proficient in working with 3D design systems (i.e. Solid Works).
Strong commercial mindset with the ability to translate mechanical and technical solutions into clear customer value propositions.
Able to act as the technical bridge between customers and Boschman Engineering during:
Concept discussions
Feasibility assessments
Technical clarifications and proposal phases
Excellent verbal and written communication skills in English and Chinese and able to communicate effectively with internal and external stakeholders in an international environment.
Capable of working independently, able to set priorities and to meet deadlines.
Strong analytical and problem-solving skills with a structured way of working.
High standards of personal and professional integrity.
Willingness to travel frequently within the Asia Pacific region.
Interested?
Does the position fit your skills and ambition, and do you expect to be able to contribute to our
company?
Then we would like to get in touch with you! Please send your application (CV plus motivation letter) to
Pricia Lim (Office manager BTA), [email protected] and we will contact you soon.
Do you have questions regarding the content of the position up forehand? Then you may contact
Jules van Ee (General Manager BTA), at [email protected] or by telephone: (65) 63280 201
