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Nanyang Technological University

Research Assistant (Photonics)

Posted 2 Hours Ago
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In-Office
Singapore, SGP
Junior
In-Office
Singapore, SGP
Junior
Design, simulate, fabricate, and characterise heterogeneously-integrated photonic devices (III-V/Si, III-V/TFLN, Si3N4). Lead device runs from GDSII layout to foundry submission, post-fab assembly, and packaging. Build and operate optical and RF measurement setups (linewidth, phase-noise, RIN, S-parameters, FMCW LiDAR). Publish first-author papers and present at major conferences.
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The School of Electrical and Electronic Engineering (EEE) at NTU is one of the world’s largest engineering schools and ranks 4th globally for Electrical & Electronic Engineering (2025 QS World University Rankings by Subject). Sia Laboratories, led by Asst Prof Brian Sia, is affiliated with the National Centre for Advanced Integrated Photonics (NCAIP) and a DSO Quantum Sensing Centre, and works across heterogeneously-integrated photonics, hybrid III–V/Si and III–V/TFLN lasers, optical frequency combs, RF photonics, FMCW LiDAR, and quantum photonic sensing. We are seeking a Research Fellow, Integrated Photonics, to advance the design, fabrication, and characterisation of next-generation hybrid photonic devices and to lead system demonstrations relevant to RF channelisation, coherent LiDAR, and rubidium-based atom interferometry.

We are looking for a Research Assistant, Integrated Photonics to advance the design, fabrication, and characterisation of next-generation heterogeneously-integrated photonic devices for laser, RF photonic, LiDAR, and quantum-sensing applications. The role will focus on hybrid III–V on silicon and III–V on thin-film lithium niobate (TFLN) integration, semiconductor laser physics (E-DBR Pockels FM lasers, Vernier external-cavity lasers, optical frequency combs), and end-to-end system demonstrations in coherent FMCW LiDAR, photonic RF channelisation, and rubidium-based quantum sensing.

Key Responsibilities:

  • Design, simulate, and tape-out integrated photonic devices on silicon, thin-film lithium niobate (TFLN/TFLT), Si₃N₄, and III–V/Si heterogeneous platforms using FDTD, EME, and photonic-circuit simulators (e.g., Lumerical, Tidy3D, INTERCONNECT).

  • Develop, fabricate, and characterise hybrid III–V/TFLN and III–V/Si₃N₄ semiconductor lasers — including E-DBR Pockels FM lasers, Vernier external-cavity lasers, and optical frequency-comb sources — and lead device runs from layout (GDSII) through foundry submission, post-fab assembly, and packaging.

  • Build and operate optical and RF measurement setups for laser linewidth, frequency-noise, RIN, optical-spectrum, electro-optic S-parameter, and FMCW-LiDAR ranging characterisation.

  • Publish first-author papers in leading journals (e.g., Nature Photonics, Optica, Light: Science & Applications, JLT, JSTQE, APL Photonics) and present at flagship conferences (CLEO, OFC, ECOC, IPC, Photonics West).

Job Requirements:

  • Bachelor in Electrical and Electronic Engineering or related field

  • At least 2 years of relevant experiences in integrated photonics research

  • Familiarity with photonic design tools (Lumerical FDTD/EME/INTERCONNECT, Ansys, Synopsys RSoft, or Tidy3D) and GDSII layout in KLayout, gdsfactory, IPKISS, or PHIDL

  • Good written and oral communication skills evidenced by first-author publications in leading photonics journals and presentations at flagship conferences (CLEO, OFC, ECOC, IPC, Photonics West)

  • Proficiency in practical optical and microwave measurement (tunable lasers, OSAs, ESAs, VNAs, lock-in detection, RF probing); familiarity with phase-noise / linewidth / RIN measurement and coherent detection is a strong advantage

  • Competent in scripting and data analysis in Python or MATLAB, with comfort using version control (Git) and reproducible scientific workflows

  • Strong interpersonal skills, with the ability to work independently and deliver against tight project milestones, meticulous attention to detail, and excellent organisational, documentation, and time-management habits

  • Preferred: prior experience with one or more of — photonic packaging and butt-coupling, flip-chip / wire-bond assembly, electro-optic modulator design, FMCW LiDAR system architecture, or atom-interferometry-grade laser systems

We regret to inform you that only shortlisted candidates will be notified.

Hiring Institution: NTU

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