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Applied Materials

Process Engineering Intern (Hybrid Bonding)

Posted 27 Days Ago
Be an Early Applicant
Hybrid
Singapore, SGP
Internship
Hybrid
Singapore, SGP
Internship
Support hybrid bonding system development for advanced semiconductor packaging. Conduct entry-level process engineering experiments, operate surface, material, structural, and topographic metrology and inspection tools, execute design of experiments, collect and analyze data, and compile technical reports under supervision and safety guidelines. The role involves cleanroom exposure, tool development support, and collaboration with process engineers on characterizing industrial systems.
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Who We Are


Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology. 


What We Offer


Location:

Singapore,SGP

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. 

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. 

Looking for young passionate interns with characteristics of strong hands-on, analytical thinking, and self-motivated learning to join our core technology team. Qualified intern students with good intern performance will be given priority consideration to join core development team after graduation.

Field of Work

  • Advanced packaging - hybrid bonding system development.

  • Exposure to independent operation of a variety of industrial & lab surface/ material/ structural/ topographic metrology & inspection tools commonly used for hybrid bonding technology. Exposure to cleanroom environment.

Key Responsibilities

  • Design, collect data, analyze and compile reports on entry-level process engineering experiments, under supervision and within safety guidelines

  • Support process engineers on tool development, DOE execution, data collection, and data analysis & interpretation to characterize industrial system under development

Functional Knowledge

  • Demonstrates conceptual knowledge in own discipline and broadens capabilities

Leadership

  • No supervisory responsibilities but interact with co-workers and resources to accomplish assigned projects

Problem Solving

  • Solves problems in straightforward situations; analyzes possible solutions using technical experience and judgment and precedents 

Impact

  • Impacts quality of own work and the work of others on the team; works within guidelines and policies

Interpersonal Skills

  • Explains complex information to others in straightforward situations

Additional Information

Time Type:

Full time

Employee Type:

Intern / Student

Travel:

No

Relocation Eligible:

No

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

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