Who We Are
Applied Materials is the global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to work beyond the cutting-edge, continuously pushing the boundaries of science and engineering to make possible the next generations of technology, join us to Make Possible® a Better Future.
What We Offer
Location:
Singapore,SGP
At Applied, we prioritize the well-being of you and your family and encourage you to bring your best self to work. Your happiness, health, and resiliency are at the core of our benefits and wellness programs. Our robust total rewards package makes it easier to take care of your whole self and your whole family. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.
You’ll also benefit from a supportive work culture that encourages you to learn, develop and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more about careers at Applied.
Applied Materials is the global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service manufacturing equipment for the semiconductor and display industries. Our innovations are at the foundation of the technology that transforms every part of our lives. We offer an exciting place to grow and learn alongside some of the best people you’ll ever meet. Join us to Make Possible a Better Future.
The Advanced Packaging Development Center (APDC) is a state-of-the-art cleanroom that is among the most advanced wafer-level packaging labs in the world. It houses the industry’s broadest portfolio of products that enable the foundational building blocks of heterogeneous integration, including advanced bump and micro-bump, fine-line redistribution layer (RDL), TSV and hybrid bonding. APDC was established as a joint lab partnership with the Institute of Microelectronics (IME), a research institute of Singapore’s Agency for Science, Technology and Research (A*STAR).
We are currently seeking for an experienced and passionate Plasma Technology Development Process Engineer to join APDC now. Apply now if you fit the description below!
Key Responsibilities
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Improve current generation plasma activation technology for hybrid bonding and develop next generation plasma technology and process
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Design and execute experiments to study various types of plasma and their processes to understand their interaction with bonding surfaces. Analyze data to identify the key and common factor(s) of plasma that contributes to the strongest activation for hybrid bonding.
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Optimize process and/ or drive CIP to improve current generation plasma chamber. Identify the most suitable plasma technology and conduct CnF test to define requirements for next generation chamber.
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Deep dive with engineering team to prototype next gen chamber based on defined requirements. Evaluate proto chamber for hybrid bonding process and drive engineering optimization.
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Plasma technology & process subject-matter expect to guide account/field teams on tough plasma technical issues.
Functional Knowledge
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Good understanding of plasma physics and processes is essential.
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Practical background on any types of plasma technology and its characterization is needed.
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Familiar with common plasma characterization tools (such as OES, ion sensor, RGA, thickness measurement etc.) and methodology.
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Knowhow to analyze surface characterization results (XPS, TEM, phase analysis, SIMS, EELS, etc) is a strong plus.
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Any backgrounds of WoW or CoW bonding is a bonus.
Opportunities
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On-job training on CoW hybrid bonding processes and challenges. Hands-on on the state-of-the-art integrated hybrid bonder to witness and contribute to the historical industrial inflection from micro-bump to hybrid bonding.
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Opportunity of oversea training by/ interaction with engineering team/ plasma experts if needed
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Technical training on/ exposure to up & downstream integration processes and interaction with hybrid bonding
Requirements
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Engineering or science university educational background.
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> 5 years experiences on plasma technology. Background on plasma development is strongly preferred.
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10% travel commitment to the US (California), Taiwan, Korea or Europe
Working Location
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Science Park II, Singapore
Additional Information
Time Type:
Full time
Employee Type:
Assignee / Regular
Travel:
Not Specified
Relocation Eligible:
No
Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
