Equipment Associate Engineer

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This role will be to support the manufacturing equipment at the Wafer Fabrication plant located at either Senoko or Depot Road.

The successful candidate is expected to:

Perform Preventive Maintenance (PM) and equipment troubleshooting to minimise downtime.
Identify and address potential areas for improvement and optimize tools availability and cost.
Develop creative and innovative solutions to problems with considerable initiative and independent thought.
Communication with Engineers and external vendors to resolve problems and provide advanced training to less experienced Associate Engineers
Complete all required reporting and documentation.
Actively participate in continuous improvement projects, learning, and skill development.
Strong team member, able to carry out tasks and other duties as assigned within a team and able to handle multiple tasks simultaneously and prioritise activities.
Part of the ERT core team, and ensure good safety practices. Owner of tools, equipment, and other properties.
Maintain good housekeeping in the production floor, office and maintenance support areas.

Experience Required:

Troubleshooting one or more of the Wafer Fabrication Process Tools, for example, Photolithography, Implanters, CVD, Stepper machines, etc.
Troubleshooting in various kinds of high vacuum systems in a cleanroom environment
Qualifications:
At least a Diploma or Professional Certification in Electrical, Mechatronics or Mechanical Engineering.

Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.