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Applied Materials

Director, Hybrid Bonding Technology

Posted 22 Days Ago
Be an Early Applicant
Singapore
Expert/Leader
Singapore
Expert/Leader
Lead the development and validation of hybrid bonding technologies, manage a team, engage customers, and drive product development strategy.
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Who We Are

Applied Materials is the global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to work beyond the cutting-edge, continuously pushing the boundaries of science and engineering to make possible the next generations of technology, join us to Make Possible® a Better Future. 

What We Offer

Location:

Singapore,SGP

At Applied, we prioritize the well-being of you and your family and encourage you to bring your best self to work. Your happiness, health, and resiliency are at the core of our benefits and wellness programs. Our robust total rewards package makes it easier to take care of your whole self and your whole family. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits

You’ll also benefit from a supportive work culture that encourages you to learn, develop and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more about careers at Applied.

Key Responsibilities:

  • Develop and Validate New Technologies: Lead the research, development, and validation of cutting-edge technologies to enhance hybrid bonding processes.

  • Understand Impact of Upstream and Downstream Steps: Analyze and understand the effects of upstream and downstream processes on hybrid bonding technology, ensuring seamless integration and optimization.

  • Drive Product Development Roadmap: Strategically drive the product development roadmap, aligning with business goals and technological advancements.

  • Solve High-Value Customer Problems: Address and resolve high-value customer issues, leveraging technical expertise to deliver innovative solutions.

  • Customer Engagement: Travel to meet customers, understand their requirements and pain points, and translate these insights into actionable strategies and solutions.

  • Direct Technology Team: Lead a team responsible for research, development, and implementation of new products and enhancements to existing product lines.

  • Manage Complex Applications: Oversee the application of scientific theory and processes in the development and ongoing technical management of the unit's products.

  • Provide Guidance to Engineers: Offer expert guidance and mentorship to process and hardware engineers, fostering a collaborative and high-performance engineering environment.

  • Lead Alpha and Beta Product Releases: Guide the alpha and beta product release processes for the business unit's product line.

  • Define Performance Metrics: Establish performance metrics and report on the organization's progress against specific goals.

Qualifications:

  • Proven experience in technology leadership within the semiconductor or related industry.

  • Strong background in hybrid bonding technology and process.

  • Excellent problem-solving skills and ability to address complex technical challenges.

  • Effective communication and interpersonal skills to engage with customers and cross-functional teams.

  • Willingness to travel as needed to meet with customers and stakeholders.

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 10% of the Time

Relocation Eligible:

No

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

Top Skills

Hybrid Bonding Technology
Semiconductor Processes

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