Manage silicon bump and package assembly suppliers, oversee backend processes, define processes, and implement improvement activities for new product introduction and quality assurance.
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Job Description:Job Description:
–You are responsible to drive and manage the silicon Bump & package assembly suppliers, backend processes and solutions to achieve the aggressive TQRDCEB goals. You will work closely with package design & technology, test & product engg, production planning, quality engg & NPI teams, assembly/substrate suppliers to support new product & technology introduction activities by defining processes, monitoring systems, manage process improvements and changes. Provide day-to-day support to bump and assembly suppliers & internal planning, product and test engineering teams. Plan, drive & implement improvement activities for continual improvement, 2nd sourcing, cost reduction & customer satisfaction.
Qualifications: –PhD / Master / Degree in Mechanical / Electrical / Electronics Engineering with 7~12 years of relevant experience of managing advanced node silicon bumping, large body single & multi-chip (2.1/2.5/3D) package assembly, substrate & back-end suppliers and processes.
–Hands on experience in Product Life-Cycle Management - creating & maintaining Bill of Material structure, Process Documentation, Process Change Notification etc.
–Good team player, result oriented individual, experienced in project management, failure analysis tools, techniques and TQM. Good analytical, problem-solving skills. Flexible and agile.
–Sound knowledge of applicable industry standards, quality systems, regulations, knowledge of prevailing and emerging silicon package & substrate technologies, bumping and assembly processes, materials and equipment.
–Able to communicate with internal team members & external partners in various geographic locations and may required to travel from time to time at short notice.
–Experienced AutoCAD user. Knowledge of silicon & PCB fabrication, board assembly processes, are an added advantage
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Top Skills
Autocad
Bill Of Material
Product Life-Cycle Management
Broadcom Singapore Office
Singapore
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