Teams at NXP Semiconductors

Coordinates and executes semiconductor tape-out processes, verifies physical and logical design data, ensures compliance with foundry requirements, resolves technical issues with cross-functional teams, and maintains detailed tape-out documentation. The role supports timely delivery of accurate integrated circuit designs to manufacturing and requires semiconductor design-tool experience, precision, and flexibility during critical tape-outs.

Coordinate semiconductor tape-out processes and ensure integrated circuit design data meets foundry manufacturing requirements. Review physical design databases and documentation, resolve discrepancies, collaborate with design and process engineering teams, and maintain detailed records of tape-out procedures and outcomes. The role requires semiconductor design tool experience, strong attention to detail, effective cross-functional communication, and flexibility to support critical tape-outs.

Coordinates semiconductor IC tape-out activities and serves as the final design-data checkpoint before fabrication. Reviews physical and logical design databases, documentation, and foundry requirements; resolves discrepancies with design, process engineering, technology, program management, and manufacturing teams; maintains tape-out records; and supports timely, accurate delivery of manufacturable design data.