Teams at NXP Semiconductors

Coordinate semiconductor tape-out processes and ensure integrated circuit design data meets foundry manufacturing requirements. Review physical design databases and documentation, resolve discrepancies, collaborate with design and process engineering teams, and maintain detailed records of tape-out procedures and outcomes. The role requires semiconductor design tool experience, strong attention to detail, effective cross-functional communication, and flexibility to support critical tape-outs.

Coordinates semiconductor IC tape-out activities and serves as the final design-data checkpoint before fabrication. Reviews physical and logical design databases, documentation, and foundry requirements; resolves discrepancies with design, process engineering, technology, program management, and manufacturing teams; maintains tape-out records; and supports timely, accurate delivery of manufacturable design data.

Leads end-to-end ATE test hardware development for wafer sort and final test, including architecture, schematic design, PCB layout, SI/PI analysis, validation, debugging, release, and production support. Partners with engineering, operations, quality, procurement, suppliers, and manufacturing teams to deliver high-performance hardware. Establishes design methodologies, manages technical risks and initiatives, mentors engineers, and drives supplier capability and continuous improvement across semiconductor test programs.