Teams at GlobalFoundries

Sustain and improve 300mm PVD wafer processes using SPC/ESPC and DOE. Analyze yield and split-lot data with JMP and Klarity ACE, manage recipes in RMS, create SPC charts in PROMIS, lead qualification and improvement projects, coach junior engineers, and collaborate with equipment and manufacturing teams to meet quality, uptime, and OEE goals.

Operate and monitor backgrind and dicing processes, perform laminating/taping, thickness measurements, inspections, SPC data entry and equipment PMs. Troubleshoot with cross-functional teams, maintain safety and quality compliance, and may support other wafer fabrication lines.

Operate and monitor backgrind and dicing wafer processes, perform laminating/taping, thickness measurements, inspections, SPC data entry, equipment PM, and support process troubleshooting and defect reduction.