Jobs at GlobalFoundries

Sustain and improve 300mm PVD wafer processes using SPC/ESPC and DOE. Analyze yield and split-lot data with JMP and Klarity ACE, manage recipes in RMS, create SPC charts in PROMIS, lead qualification and improvement projects, coach junior engineers, and collaborate with equipment and manufacturing teams to meet quality, uptime, and OEE goals.

Operate and monitor backgrind and dicing processes, perform laminating/taping, thickness measurements, inspections, SPC data entry and equipment PMs. Troubleshoot with cross-functional teams, maintain safety and quality compliance, and may support other wafer fabrication lines.

Operate and monitor backgrind and dicing wafer processes, perform laminating/taping, thickness measurements, inspections, SPC data entry, equipment PM, and support process troubleshooting and defect reduction.

The role involves maintaining equipment readiness, performing preventive maintenance, troubleshooting equipment, and supporting safety practices in an engineering environment.

The role involves improving process integration and yield issues, managing projects, collaborating across teams, and driving continuous improvements in semiconductor manufacturing.

Responsible for maintaining equipment readiness through preventive maintenance, troubleshooting, driving improvement plans, and ensuring compliance with safety standards.

Lead RF reliability planning, testing, and assessments for RF-SOI and RF-SiGe technologies. Develop SOA models for RF switches and power amplifiers, drive root-cause analysis and failure analysis, update FMEAs, prepare qualification plans/reports, and support reliability lab operations and sample logistics.

As an Assoc Eng for Contamination Free Manufacturing, you will maintain AMC detection systems, analyze contamination issues, and lead daily operations. Responsibilities include troubleshooting alarms, incident reporting, and ensuring monitoring systems function correctly while following safety protocols.

The role involves resolving process integration issues, driving continuous improvements, managing projects, and collaborating with multidisciplinary teams to enhance manufacturing processes.

Perform TEM sample preparation and FIB-based lamella milling for failure analysis, including wafer cleaving, optical inspection, coating, RIE/polishing; support night shift operations, urgent fab requests, maintain safety and quality, and collaborate across shifts.

Identify and resolve process integration and yield issues for CVD processes using data-driven analysis and structured problem solving. Lead process optimization, defect reduction, test-structure design, module characterization, and design-rule development while collaborating cross-functionally and driving continuous improvement with clear documentation and EHS adherence.

Lead process integration and yield improvement for CMOS projects: troubleshoot integration issues, perform data analysis and characterization, develop processes and test structures, drive defect reduction and continuous improvement, document processes and mitigation strategies, and collaborate across cross-functional teams.

Perform preventive maintenance, troubleshooting, and shift support for wafer fabrication equipment. Follow SOPs, execute checks and documentation, maintain housekeeping and safety, participate in module improvements, and comply with EHSS policies to ensure equipment readiness and production continuity.

Identify and resolve process integration and yield issues; develop and characterize processes and test structures; drive defect analysis and continuous improvement; support design-rule development and cross-functional teams; ensure documentation and EHS compliance.

Develop and refine semiconductor process formulations, methods, and controls; create technical charts, SOPs and FMEAs; integrate equipment/material capabilities; drive continuous improvement and collaborate with cross-functional teams to meet quality and technology specifications.

Lead process integration and yield improvement in a 300mm fab by running DOE, monitoring SPC/CPK and ET, resolving integration issues, setting yield targets, and running prototype lots.

The role involves developing AI strategies for various business functions, implementing POCs, collaborating with teams on AI solutions, and ensuring compliance with AI governance.

Provide engineering support for semiconductor process operations: oversee production activities and automated assembly tools to meet cycle time, throughput, and shipment goals; support capacity modeling/UPH assumptions with engineering and industrial engineering; drive manufacturing efficiencies, quality, and productivity improvements; follow EHS&S requirements and collaborate across projects.

Perform advanced failure analysis on wafer and package samples using Auger, XPS, SIMS, 4PB, nano-indentation, XRD and other tools. Interpret data, document root causes, produce reports, maintain FA procedures and training, support fab operations and TD, develop new FA techniques, and ensure equipment upkeep and lab safety.

Prepare monthly financial statements, forecasts, budgets and financial models. Analyze fab financial and operational results, support cost reduction initiatives, and assist with ad hoc projects while ensuring EHS compliance.