Teams at Broadcom

Designs complex flip-chip BGA packages for high-performance ASICs used in AI, networking, HPC, and 5G. Responsibilities include package layout and routing, high-speed SerDes and RF structures, impedance matching, signal and power integrity, thermal management, manufacturability, reliability, and coordinating multiple projects with global teams and external vendors.

Design and verify CMOS I/O and analog/mixed-signal circuits, including references, op-amps, comparators, and power-on-reset circuits. Run AC/DC, signal integrity, jitter, power, reliability, and EMIR analyses. Collaborate with layout teams, create Verilog, Liberty, and IBIS models, document designs, and support chip integration and silicon bring-up. The role requires advanced-node CMOS expertise, knowledge of I/O protocols, and proficiency with Cadence Virtuoso and SPICE/Spectre simulation.

Operates semiconductor fabrication equipment and performs wafer-processing steps including alignment, masking, etching, and diffusion. Calibrates equipment, monitors processes, troubleshoots deviations, and implements corrective actions under close supervision. Follows standard procedures, completes routine assignments, develops job skills, and shares information with the team. The role requires limited judgment and typically less than one year of related experience.