Teams at Broadcom

Operates semiconductor fabrication equipment to perform wafer processing functions such as alignment, masking, etching, and diffusion. Calibrates equipment, follows standard procedures, troubleshoots process issues, and implements corrective actions under close supervision. The role involves routine assignments, limited judgment, detailed instructions, and sharing information with the team. Typically requires less than one year of related experience.

Designs complex flip-chip BGA packages for high-performance ASICs used in AI, networking, HPC, and 5G. Responsibilities include package layout and routing, high-speed SerDes and RF structures, impedance matching, signal and power integrity, thermal management, manufacturability, reliability, and coordinating multiple projects with global teams and external vendors.

Design and verify CMOS I/O and analog/mixed-signal circuits, including references, op-amps, comparators, and power-on-reset circuits. Run AC/DC, signal integrity, jitter, power, reliability, and EMIR analyses. Collaborate with layout teams, create Verilog, Liberty, and IBIS models, document designs, and support chip integration and silicon bring-up. The role requires advanced-node CMOS expertise, knowledge of I/O protocols, and proficiency with Cadence Virtuoso and SPICE/Spectre simulation.