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The role involves developing AI and ML solutions for semiconductor workflows, training Citizen Data Scientists, and integrating intelligent agents into engineering processes.

The Engineer oversees construction document management and cost control for Fab10 facilities projects, ensuring compliance, cost targeting, and change management while integrating with various stakeholders.

The internship focuses on enhancing wafer yield through electrical data analysis, defect identification, and collaboration in cross-functional teams to resolve yield issues.

Support development, characterization, and qualification of semiconductor PVD/CVD/PCVD tools. Run experiments, collect and analyze equipment data, document requirements and changes, participate in builds/installs/upgrades, collaborate with vendors and cross-functional teams, prepare technical reports, and follow safety and cleanroom protocols.

Lead and coordinate semiconductor package qualification and reliability testing for new products; develop test plans and screening methods; drive root-cause analysis and 8D corrective actions; present technical reports; and liaise with internal teams and customers on package quality and release recommendations.

The Director will oversee the PDE NPI team, ensuring successful execution of New Product Introductions, leading cross-functional collaborations, managing team performance, and driving continuous improvements in advanced packaging technologies.

Lead global Diffusion HVM process engineering to improve manufacturing capability, productivity, yield, and equipment performance. Drive supplier engagement, equipment technology development, cross-functional alignment, and mentor a team to meet technology and cost leadership goals.

Lead design, expansion, maintenance, and reliability improvements for semiconductor fab mechanical and cleanroom systems (HVAC, chillers, cooling towers, compressed air, process cooling, etc.). Drive preventive and predictive maintenance, troubleshoot production-impacting issues, perform root-cause analysis, manage spare parts and procurement, and implement sustainability and smart/AI initiatives.

Intern will analyze burn-in equipment downtime data, identify root causes, propose engineering improvements to increase equipment availability, and deliver reports and (optionally) a simple tracking dashboard while gaining hands-on exposure to semiconductor equipment engineering.

This role involves advancing thin film process development for NAND technology through experiments, material characterization, collaboration with teams, and project leadership.