Top Engineering Jobs in Singapore

Support process development, improvement, and qualification of test equipment and processes. Coordinate global continuous-improvement and technology transfer, manage projects to HVM, analyze yields/costs, apply problem-solving (8D, FMEA, TPC), and leverage AI/LLMs for analytics, reporting, and automation. Provide technical support, documentation, and mentor/collaborate with global teams.

Leads functional and design validation for advanced NAND products using silicon and simulation platforms. Develops deterministic tests, random sequence generators, and automation frameworks in C, Python, and Perl. Performs electrical failure analysis, root-cause investigations, and cross-functional issue resolution. Uses Verilog, Synopsys VCS, dashboards, data analytics, and AI/ML techniques to improve validation coverage, test efficiency, defect triage, and debug productivity.

Internship focused on semiconductor process integration, device reliability, and data-driven improvement for NAND, DRAM, and HBM manufacturing. The intern will study process interactions, failure mechanisms, yield, reliability, and manufacturing data while gaining exposure to analytics, automation, dashboards, and AI/ML tools. Deliverables include technical documentation, analysis reports, improvement evaluations, and an analytics or automation demonstration. The role involves collaboration across process, manufacturing, yield, product, and failure analysis teams.

Five-month internship focused on SSD depanel process characterization and optimization in semiconductor manufacturing. Responsibilities include executing statistical Design of Experiments, analyzing process and equipment data, identifying variation sources, establishing operating windows, developing visualizations, collaborating with engineering stakeholders, and evaluating AI-enabled tools for automated analysis, anomaly detection, reporting, and knowledge capture.

Interns will develop AI-enabled and digital solutions for semiconductor failure analysis workflows. Responsibilities include analyzing laboratory metrics and engineering datasets, creating dashboards and automation tools, exploring AI and knowledge-management applications, collaborating with Test Engineering stakeholders, and presenting project findings. The role provides exposure to electrical and physical failure analysis, semiconductor manufacturing, data analytics, workflow automation, and engineering decision-making.

Leads NAND Flash reliability engineering across test-flow definition, high-volume statistical analysis, electrical failure analysis, product qualification, and reliability risk reduction. Develops targeted stresses, screens, and countermeasures using device physics, circuits, process, and test expertise. Collaborates cross-functionally with fab, design, technology, development, systems, and quality teams. Supports customers, mentors junior engineers, drives strategic reliability initiatives, and applies AI-enabled tools to improve engineering effectiveness.

Owns development, qualification, and deployment of advanced semiconductor metrology applications for 3D NAND process development. The role focuses on FIB and complementary techniques such as AFM, SEM, and WLI, while evaluating next-generation systems, developing technology roadmaps, partnering with suppliers, and applying AI, machine learning, and data analytics to improve defect detection, yield, reliability, and manufacturing readiness.

Develop and execute functional and design validation flows for advanced NAND devices. Build automation infrastructure, deterministic tests, random sequence generators, and NAND interfaces using C-based programming, Python, and Perl. Apply AI/ML and data analytics to improve failure triage, root-cause analysis, validation coverage, and debugging. Perform electrical failure analysis across digital and analog circuitry, track validation metrics, and collaborate cross-functionally to resolve issues.

Intern will develop and deploy a digital Target Traveler solution for semiconductor Probe operations. Responsibilities include analyzing process flows, defining control requirements, configuring workflows, creating data collection and compliance dashboards, monitoring deviations, and recommending process improvements. The role involves collaboration with engineering, manufacturing, quality, and IT teams while building experience in semiconductor process control, analytics, workflow automation, digital transformation, and AI-enabled manufacturing.

The MTS/Principal Engineer leads WET process development for NAND technology, conducting experiments, supporting process integration, and mentoring junior staff, while collaborating across teams to drive innovation and optimize processes.