Top Engineering Jobs in Singapore

The Principal Engineer leads wet process development for NAND memory technology, driving experiments, cross-functional collaboration, and innovation in process solutions.

The Staff Engineer oversees wet process module execution for NAND, optimizing processes, leading experiments, and driving cross-functional integration to enhance yield and reliability.

Develop and test SSD firmware subsystems to meet performance, endurance, capacity, functionality, and reliability specs. Create firmware unit and functional tests, debug and modify embedded code (C, assembly, machine language, Python), integrate AI-assisted tools, communicate status to stakeholders, and mentor team members.

Lead a multi-discipline engineering team for semiconductor chemical and gas systems across South Asia. Own design, construction, start-up, operations, and maintenance for greenfield FAB projects. Drive standardization, cost management, sustainability, continuous improvement, stakeholder collaboration, and technical problem solving while mentoring staff and supporting global facilities programs.

Lead regional civil, structural, and architectural engineering for semiconductor manufacturing sites. Provide design review, construction oversight, reliability and sustainability support, standards alignment, vendor/A&E coordination, structural analysis, site inspections, cost/schedule control, and cross-functional technical leadership for large EPC projects and facility expansions.

The role focuses on product reliability, involving test development, execution, problem-solving, risk management, and cross-functional collaboration to drive innovations in high bandwidth memory technology.

Develop and deploy next-generation 3D NAND dry etch processes before device ramp. Responsibilities include evaluating tool performance, optimizing process windows and recipes, troubleshooting yield and quality issues, driving process simplification, collaborating with fabs, vendors, and cross-functional teams, and integrating manufacturing methods into new technology nodes.

Engineering intern supporting semiconductor assembly output, yield, quality, reliability, and cost improvements. Responsibilities include studying assembly equipment and process controls, analyzing process and equipment data, planning experiments, applying statistical methods and root-cause analysis, proposing improvements, implementing approved solutions, and monitoring effectiveness. The role also explores Generative AI and Agentic AI for engineering analysis, documentation, and productivity.

The role involves yield data analysis in semiconductor manufacturing, resolving yield issues, and collaborating across teams to improve processes.

Drives HBM package product engineering, assembly and cube yield improvement, DPM reduction, cumulative yield ownership, and resolution of packaging quality and RMA issues. Leads process conversions, failure analysis, cross-functional manufacturing initiatives, technical decisions, and AI/ML projects focused on quality, cost, cycle time, and scale. Requires collaboration with global semiconductor, packaging, design, reliability, and manufacturing teams, including international travel.