Top Engineering Jobs in Singapore

Lead CMP process development, characterization, and transfer for 3D NAND nodes. Drive yield, manufacturability, cost reduction, process monitoring, supplier engagement, and cross-site projects while applying failure analysis and AI-driven process improvements.

The Staff/Principal Engineer will lead dry etch process development for NAND technology, collaborating with cross-functional teams and mentoring peers while managing technical projects and presenting technology roadmaps.

Lead technical authority in 3D NAND cell film development, overseeing multi-functional projects, technical strategy, mentorship, and advanced process development.

As a Member of Technical Staff, you will lead the development of Dry Etch technology for NAND products, collaborating with multi-functional teams, managing processes, and mentoring junior engineers while contributing to innovative solutions.

The Staff Engineer develops and optimizes thin film processes, addresses process issues, supports scaling, and mentors junior engineers while ensuring compatibility with integration and device teams.

Process Integration Engineer responsible for improving yield, quality, and output on NAND Flash production. Design and analyze process experiments, collect and interpret data, lead cross-functional teams to resolve process issues, collaborate with global partners and production engineering, and integrate AI-assisted tools to enhance efficiency and continuous improvement.

The Engineer will support RAM operations, optimize tool performance, manage lot disposition, train team members, and enhance processes through data analysis.

Support development, characterization, and qualification of semiconductor PVD/CVD/PCVD tools. Run experiments, collect and analyze equipment data, document requirements and changes, participate in builds/installs/upgrades, collaborate with vendors and cross-functional teams, prepare technical reports, and follow safety and cleanroom protocols.

Lead wet-process and chemistry pathfinding for next-generation NAND: develop advanced wet etch, clean, and surface modification solutions, apply AI/ML and analytics, partner with suppliers and research collaborators, integrate across process teams, and mentor engineers.

The role involves product development and validation for HBM products, optimizing test coverage, improving yields, supporting new designs, and collaborating with cross-functional teams.