Top Engineering Jobs in Singapore

Conduct experiments to improve poly-SiGe gap filling in high-aspect-ratio semiconductor structures. Analyze deposition effects on film growth, conformality, voids, seams, pinch-off, and structural integrity using DOE, SEM/TEM cross-sections, and statistical methods. Correlate fill quality with die strength and wafer or block bending, then recommend optimized process windows and qualification plans. Collaborate with engineering teams and subject matter experts throughout the development cycle.

Conduct a semiconductor process-engineering project focused on wafer thermal management and plasma strip optimization. Plan experiments and Design of Experiments studies, analyze manufacturing data using statistics, process modeling, visualization, and AI-enabled workflows, and develop predictive analytics linking chuck temperature to process performance. Deliver thermal-characterization findings, optimization recommendations, and a technical presentation aimed at improving process robustness, yield, productivity, and cost performance.

Conduct silicon design validation for advanced NAND products through Verilog simulations, validation planning, laboratory measurements, and data analysis. The intern will use testers, oscilloscopes, probe stations, scripting, and engineering software to analyze validation data, generate technical reports, and prototype AI-enabled workflows for automated data collection, reporting, or anomaly detection.

Supports advanced copper sputter process development for HBM semiconductor metallization. Responsibilities include process characterization, hardware qualification, integration assessment, statistical and machine-learning analysis, defect reduction, yield improvement, and manufacturing readiness. The intern will use AI, manufacturing systems, and data analytics to identify process trends and recommendations while collaborating with process integration, manufacturing, equipment, and quality teams.

Supports a five-month product engineering project involving NAND Flash, memory products, and SSDs. Analyzes test coverage, yield data, electrical measurements, and failure mechanisms; conducts circuit simulations and engineering evaluations; and develops scripts, dashboards, automation, or AI-enabled workflows. The intern documents findings, recommends improvements to product quality and test efficiency, and presents a final technical report under experienced engineering guidance.

Supports semiconductor HBM reliability, device/package/wafer testing, failure analysis, product debugging, laboratory operations, inventory and logistics, audits, safety compliance, automation, data analysis, and continuous improvement. Uses AI-assisted tools, Power BI, Python, SQL, and manufacturing systems to improve reliability workflows and debug efficiency. Requires rotating day/night shifts, including occasional weekends and public holidays, and collaborates with cross-functional teams while mentoring junior technicians.

Supports advanced HBM packaging and new product introduction from development through high-volume manufacturing. Applies engineering, statistical, DOE, FMEA, and control-plan methods; supports low-volume manufacturing, run-at-risk activities, product qualification, technology transfer, and corrective actions. Collaborates with development, manufacturing, and supplier teams globally while using AI-enabled tools, MES, automation, and data analytics to improve efficiency and quality.

Lead HBM package product engineering to improve yield, reduce DPM, and resolve packaging failures via EFA/PFA and cross-functional collaboration. Drive process conversions, test optimization, AI/ML adoption, and project decisions to meet quality, cost, cycle time and scale targets.

Lead global contamination-control strategy across semiconductor wafer fabs, improving yield, reliability, throughput, and cost. Responsibilities include contamination-risk mitigation, process and equipment optimization, capacity expansion support, wafer-shipment controls, KPI development, supplier collaboration, SOP standardization, and cross-functional project leadership. The role requires driving data-based monitoring, resolving process issues, supporting qualifications, coordinating global teams, and communicating outcomes across manufacturing sites.

Full-time internship focused on applying Python, statistical analysis, visualization, and introductory machine learning to semiconductor probe-test, electrical failure, and fabrication-process data. The intern will investigate yield behavior in advanced memory manufacturing, develop a multivariate analytics tool, identify potential yield-improvement opportunities, and present documented findings through a technical report and presentation.