Top Engineering Jobs in Singapore

The internship focuses on evaluating materials and processes to reduce manufacturing defects in dry etch operations while developing analytical and engineering skills.

The intern will analyze manufacturing processes, identify inefficiencies, and design automation concepts to improve operational effectiveness and productivity.

The Principal Engineer will develop advanced packaging technology, lead technical teams, consult at management levels, and drive innovation through collaboration and mentoring.

Oversee installation, maintenance, and troubleshooting of R&D equipment, manage vendor relations, and collaborate with teams to improve lab operations.

Lead RDA strategy, analyze production flows for defects, report metrics, coordinate inspection technologies, mentor engineers, and drive continuous improvement in semiconductor manufacturing.

The role involves designing, constructing, and commissioning ultra-pure water and wastewater treatment systems for semiconductor manufacturing, ensuring compliance with industry standards and sustainability considerations.

Develop and execute reliability test flows and qualification plans for HBM products, drive DPM reduction, root-cause failure analysis (EFA/PFA), recommend process conversions for HVM, manage risk and cross-functional collaboration, mentor team members, and make technical decisions to improve yield, quality, and reliability.

Develop and maintain test programs and infrastructure for HBM component validation. Support test equipment qualification, hardware readiness, high-speed I/O validation, debugging, version control, and cross-functional root cause analysis to ensure stable, repeatable validation across sites.

Lead development of reliability stress flows, test plans, and qualification execution for HBM products. Drive DPM reduction via optimized test strategies, perform root-cause analysis (EFA/PFA), recommend process conversions for HVM, manage risk with product leads, mentor engineers, and collaborate cross-functionally with fab, design, and quality teams.

Student internship to analyze NAND structural integration using inline characterization data. Tasks include correlating structural parameters with probe yield and device performance, defining inline monitoring specifications, collaborating across process areas, producing a technical report, and presenting findings to stakeholders.