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41 Minutes AgoSaved
In-Office
Singapore, SGP
Senior level
Senior level
Artificial Intelligence • Hardware • Information Technology • Machine Learning
The role involves developing advanced packaging processes, ensuring readiness and transition to production, and collaborating with cross-functional teams to resolve issues.
Top Skills: Data Analytics PlatformsPackaging TechnologySemiconductor TechnologySimulation Tools
41 Minutes AgoSaved
In-Office
Singapore, SGP
Entry level
Entry level
Artificial Intelligence • Hardware • Information Technology • Machine Learning
The PI Engineer drives process integration for HBM products during NPI, collaborating cross-functionally to ensure readiness and resolve issues while leveraging AI tools for efficiency.
Top Skills: Ai ToolsData AnalysisExcelJmpProcess IntegrationPythonSemiconductor Manufacturing
Senior level
Artificial Intelligence • Hardware • Information Technology • Machine Learning
Lead and develop a high-performing team to enhance package and HBM product engineering activities, focusing on quality, cost, and cycle time improvements while collaborating across various teams.
Top Skills: CPython
41 Minutes AgoSaved
In-Office
Singapore, SGP
Entry level
Entry level
Artificial Intelligence • Hardware • Information Technology • Machine Learning
The role focuses on quality monitoring and risk management using data analytics in semiconductor manufacturing, supporting new product introduction and process improvement.
Top Skills: Data AnalyticsFault DetectionRda PlatformsStatistical Process Control
Junior
Artificial Intelligence • Hardware • Information Technology • Machine Learning
The Engineer will develop and sustain RDA capabilities to improve equipment performance and process control in semiconductor manufacturing during NPI and ramp phases.
Top Skills: Ai-Assisted ToolsFault Detection & ClassificationManufacturing Data SystemsRda PlatformsStatistical Process Control
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41 Minutes AgoSaved
In-Office
Singapore, SGP
Junior
Junior
Artificial Intelligence • Hardware • Information Technology • Machine Learning
The Shift Engineer will manage advanced packaging equipment stability, address equipment issues, support NPI processes, and collaborate with engineering teams for continuous improvement.
Top Skills: Ai-Enabled ToolsFab It SystemsFault Detection & ClassificationManufacturing AutomationRdaSpcStatistical Process Control
41 Minutes AgoSaved
In-Office
Singapore, SGP
Internship
Internship
Artificial Intelligence • Hardware • Information Technology • Machine Learning
Intern will support automation and optimization projects in test solutions engineering, focusing on data extraction, analysis, and performance efficiency.
Top Skills: Data AnalysisData ExtractionScripting
Senior level
Artificial Intelligence • Hardware • Information Technology • Machine Learning
Lead the HBM Package Product Engineering team, focusing on yield improvement, cross-functional collaboration, innovation, and mentorship, while managing project execution and technical decision-making.
Top Skills: AICircuit AnalysisData Analysis ToolsElectrical EngineeringMachine LearningMechanical EngineeringStatistics
41 Minutes AgoSaved
In-Office
Singapore, SGP
Entry level
Entry level
Artificial Intelligence • Hardware • Information Technology • Machine Learning
As a Yield Enhancement Engineer, you will monitor yields, analyze defects, and collaborate for continuous improvements, integrating AI tools for efficiency.
Top Skills: Ai-Assisted ToolsAuto-Diagnostics SoftwareData Analysis Tools
41 Minutes AgoSaved
In-Office
Singapore, SGP
Expert/Leader
Expert/Leader
Artificial Intelligence • Hardware • Information Technology • Machine Learning
The role involves developing advanced packaging processes in a semiconductor environment, ensuring process readiness, integration, and managing cross-functional teams for successful transitions from development to production.
Top Skills: Data AnalyticsDramElectrical EngineeringElectronic EngineeringMechanical EngineeringNandSimulation Tools
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