Top Engineering Jobs in Singapore

The DMTS leads technical strategy in photolithography, mentoring engineers, influencing innovation, and establishing long-term technology roadmaps for semiconductor development.

Lead package/product engineering for High Bandwidth Memory (HBM): drive yield and DPM reduction via test coverage, electrical and physical failure analysis, root-cause resolution, cross-functional projects, and technical/people leadership including mentoring and decision-making on risk and priorities.

Plan, schedule, and implement new tool installations, relocations, and chamber retrofits. Develop and own equipment maintenance procedures and preventative schedules. Collaborate with process owners and vendors to improve equipment performance, uptime, and cost reduction, and report on improvements. Maintain QMS components and integrate AI-assisted tools to drive continuous improvement.

Operate FIB and TEM for TEM sample preparation and device analysis on night shift; prepare high-quality samples, communicate with customers, innovate and improve FIB/TEM techniques, maintain lab procedures and safety, and ensure smooth shift handovers.

Lead development and governance of global electrical and equipment safety programs. Serve as technical expert for complex, high-risk systems, ensure compliance with SEMI S2/NFPA 79/IEC 60204-1, review safety documentation and third-party assessments, and drive safe-by-design across cross-functional teams and suppliers.

Lead 3D NAND process integration and roadmap development, driving end-to-end R&D from concept to validation. Use data-driven, AI-assisted and model-based methods to solve integration challenges, define module/process architectures, collaborate across device, test, design and operations teams, and contribute patents and publications while improving processes and yield.

Lead mechanical construction engineering for global semiconductor facility projects across design, construction, commissioning, and operations. Provide technical support, review designs, manage scope/schedule/cost/quality, resolve construction issues, support estimating and business cases, coordinate cross-functional teams, drive continuous improvement and sustainability, and integrate AI-assisted tools into engineering workflows.

Lead the NAND Module Process Integration, improving 3D NAND product yield and quality while developing module specifications, optimizing processes, and innovating solutions.

The role involves developing and optimizing advanced packaging assembly processes, ensuring quality improvements, coordinating with stakeholders, and supporting technology transfers to manufacturing.

Lead and grow a team of diffusion and implant engineers to develop and transfer 3D NAND process modules. Drive process characterization, DOE-driven optimization, process monitoring/control, manufacturability, supplier partnerships, and adoption of data analytics/AI to improve yield, cost, and scalability while supporting pilot ramps and high-volume manufacturing.