Top Engineering Jobs in Singapore

Leads HBM product system engineering and manufacturing test development for next-generation memory products. Responsibilities include test coverage optimization, product validation, circuit debugging, yield improvement, cost and test-time reduction, root-cause analysis, DFT strategy, technical decision-making, cross-functional collaboration, and team mentorship. The role also drives innovation, project execution, and productivity improvements using AI tools.

As a Senior Member of Technical Staff, you'll lead the development and integration of 3D NAND processes, focusing on innovation, performance optimization, and cross-functional team coordination.

Perform electrical characterization and high-volume experiments on NAND cell arrays and test structures to identify failure mechanisms. Design experiments, analyze statistical data, assess reliability risks vs. JEDEC/internal qualifications, and drive process and product engineering solutions and roadmap for next-generation NAND.

The role involves validating and characterizing advanced NAND products using silicon validation techniques, automation, and applied AI/ML methods. Responsibilities include designing validation flows, conducting failure analysis, and improving test efficiency.

Performs electrical and physical failure analysis for semiconductor device anomalies, customer returns, and qualification failures. Uses advanced microscopy, imaging, probing, and testing tools, along with Bash and Python in Unix environments, to identify failure mechanisms. Collaborates with process and product teams, develops improved analysis techniques, maintains lab safety and quality standards, prepares reports, presents findings, guides technicians, and supports automation, analytics, and AI-enabled workflow improvements.

Conduct a five-month engineering project optimizing Chemical Mechanical Planarization processes and characterizing equipment in semiconductor manufacturing. Analyze process, metrology, equipment, and manufacturing data using statistical and AI-assisted methods; assess process capability and qualification results; and develop a dashboard, analytics model, or automation tool. Collaborate with cross-functional stakeholders and deliver technical reports, presentations, engineering recommendations, and documented improvement results focused on stability, yield, cost, productivity, or data accessibility.

Develop and improve NAND cell reliability through electrical characterization, high-volume wafer- and component-level experiments, statistical analysis, failure-mechanism identification, and risk assessment. Coordinate process, trim, and test strategies to meet JEDEC and internal qualification requirements. Provide reliability updates and roadmap feedback to cross-functional engineering teams, while contributing to next-generation NAND technology development and product capability projections.

Defines and drives chip-package interaction technology strategy and roadmaps for advanced silicon node transitions in next-generation memory products. Leads cross-functional collaboration across silicon, package, assembly, quality, and product development teams to ensure technology readiness, mitigate risks, and execute innovative solutions. The role requires technical leadership and proficiency with AI-based workflows.

Supports NAND product development from silicon through system integration. Responsibilities include translating business and SSD requirements into qualification specifications, developing AI-enabled data workflows, coordinating technology, design, fabrication, assembly, test, quality, supply chain, and business teams, and managing product qualification priorities. The role leads reviews, cross-functional meetings, capability assessments, and resolution of NAND-system issues to enable timely customer product qualification.

Supports 24x7 advanced semiconductor packaging operations during NPI and early production ramps. Monitors equipment health, SPC/FDC alerts, alarms, process excursions, and operational metrics; performs first-pass troubleshooting and root cause analysis; documents shift events and handovers; supports tool installation, qualification, recovery, and stabilization; and deploys RDA capabilities, dashboards, scripts, and monitoring logic. Collaborates with Process, Equipment, NPI, Automation, IT, and global RDA teams to improve equipment reliability, data integrity, and manufacturing readiness.