Top Engineering Jobs in Singapore

Lead development, qualification, and optimization of wafer-level bonding processes (hybrid, fusion, temporary). Drive yield, reliability, and cost improvements using DOE, FMEA, 8D, and SPC; qualify bonding equipment (EVG, TEL, Disco), introduce materials/spares, support technology transfer and ramp-up, troubleshoot manufacturing issues, and establish control plans and risk mitigation frameworks across global sites.

Lead technical authority in 3D NAND cell film development, overseeing multi-functional projects, technical strategy, mentorship, and advanced process development.

Lead HBM package and product engineering efforts to improve yield, quality, cost, cycle time, and scale. Drive assembly and cube yield improvements, root-cause failure analysis (EFA/PFA), process conversions, cross-functional projects, and AI/ML model deployment to optimize KPIs. Manage projects, technical decisions, and collaborate with fab, TD, design, quality, and packaging teams to deliver high-volume manufacturing HBM products.

The Staff Engineer will provide technical support for mechanical systems, manage construction projects, ensure alignment with global standards, and drive sustainability initiatives and operational excellence.

Design, develop, and deploy software and system solutions for semiconductor manufacturing to improve productivity, yield, and quality. Integrate AI-powered analytics and automation, build user interfaces and databases, manage enterprise applications, lead projects, mentor teammates, and collaborate with vendors and stakeholders to commission and maintain reliable production systems.

As a Member of Technical Staff, you will lead the development of Dry Etch technology for NAND products, collaborating with multi-functional teams, managing processes, and mentoring junior engineers while contributing to innovative solutions.

Support fab cleanroom and ESD controls by monitoring contamination (AMC, particles, trace metals), qualifying FOAK equipment/materials, leading OOC/OOS investigations with RCA and CAPA, developing monitoring protocols, collaborating across manufacturing and engineering teams, ensuring compliance with quality and ESD standards, and applying AI/RPA analytics to automate data collection and detection.

The Staff Engineer develops and optimizes thin film processes, addresses process issues, supports scaling, and mentors junior engineers while ensuring compatibility with integration and device teams.

Lead package/product engineering for High Bandwidth Memory (HBM): drive yield and DPM reduction via test coverage, electrical and physical failure analysis, root-cause resolution, cross-functional projects, and technical/people leadership including mentoring and decision-making on risk and priorities.

Develop and debug intrinsic and extrinsic reliability test programs for HBM, DRAM, and interface dies (e.g., wafer-level burn-in, pWLRx, ELFR). Perform root-cause analysis, data-driven validation using statistical tools, hardware interface specification and validation, cross-functional collaboration, mentorship, process improvements, and project prioritization to meet quality, cost, and cycle-time KPIs.