Top Engineering Jobs in Singapore

The Senior Engineer in Wet Process Development optimizes wet processes for advanced NAND technology, improves margins, and addresses quality issues through integration and experimentation, collaborating with cross-functional teams and contributing to innovation.

Lead water and waste construction engineering across full project lifecycle for semiconductor fabs. Review designs, resolve construction issues, manage cost/schedule/risk, coordinate contractors/consultants, support commissioning, sustainability, and standardization of best practices while using AI-assisted tools to optimize performance.

Own probe strategy and silicon learning at wafer test from pre-silicon to high-volume manufacturing. Define probe coverage, limits, and guard-bands; enable first-silicon bring-up and device characterization; drive yield, quality, and test-cost optimization; collaborate with Design, DFT, DV, Process Integration, Backend Test, and Reliability; leverage data and AI/ML for predictive probe and test optimization.

Develop and execute reliability stress tests, qualification plans, and test flows for HBM products. Drive DPM reduction, perform root-cause analysis using EFA/PFA, recommend process conversions for HVM, manage qualification risks, collaborate cross-functionally, make technical prioritization decisions, and embed AI/ML tools (Python, JMP, Claude) into reliability workflows to improve analytics and automation.

As a Distinguished Member of Technical Staff, you will lead process modules for 3D NAND development, optimize performance, resolve issues, and coordinate technology transfer while fostering innovation and communication across teams.

Lead firmware verification for SSD products: design test plans, develop white/grey-box and automated tests, analyze regressions and root causes, manage test deployment and CI, mentor engineers, and communicate findings across teams to ensure performance and reliability.

Lead mechanical construction for semiconductor fabs and cleanrooms, ensuring HVAC, exhaust, chilled water, CDA/PCW and other utilities meet contamination-control, safety, cost, schedule, and quality objectives. Oversee design reviews, construction coordination, commissioning, RFE/RFM readiness, handover documentation, and operations transition while driving change management, safety compliance, and continuous improvement.

Lead Package and HBM Product Engineering, improve yields, resolve packaging issues, mentor team members, and collaborate across functions for product improvement.

The Engineer CE PYE will perform fault isolation, electrical device characterization, and physical failure analysis, collaborating with product teams to improve defectivity and operational efficiency.

Lead regional mechanical facilities engineering for semiconductor sites: drive design and construction, reliability and O&M programs, sustainability alignment, project management, metrics (MTTF/MTTR, PMs), TPM/SPC process deployment, cost and energy reduction, training, and cross‑site standards and continuous improvement.