Top Engineering Jobs in Singapore

The Director will oversee the PDE NPI team, ensuring successful execution of New Product Introductions, leading cross-functional collaborations, managing team performance, and driving continuous improvements in advanced packaging technologies.

Conducts technical tests in semiconductor manufacturing, sets up processes, mentors operators, analyzes performance, and troubleshoots equipment.

The SMTS leads photolithography technology initiatives, mentors engineers, establishes long-term process roadmaps, and enhances innovation in semiconductor development.

Engineer Test Solutions will develop and maintain test programs for Micron SSD products, optimizing processes, automating tasks, and enhancing quality while collaborating with various teams.

Develop and execute reliability test flows and qualification plans for HBM products, drive DPM reduction, root-cause failure analysis (EFA/PFA), recommend process conversions for HVM, manage risk and cross-functional collaboration, mentor team members, and make technical decisions to improve yield, quality, and reliability.

Perform electrical characterization and high-volume experiments on NAND cell arrays and test structures to identify failure mechanisms. Design experiments, analyze statistical data, assess reliability risks vs. JEDEC/internal qualifications, and drive process and product engineering solutions and roadmap for next-generation NAND.

Lead R&D and technology pathfinding for advanced NAND thin films and materials. Define roadmaps, evaluate novel materials and deposition processes, integrate solutions with device and manufacturing teams, drive external collaborations, generate IP, mentor technical staff, and apply AI/advanced analytics to accelerate process development and decision-making.

Lead development of advanced dry etch processes for NAND technology, inventing plasma chemistries and equipment capabilities. Use AI/ML, analytics, and automation to accelerate process pathfinding, collaborate with integration and device teams, and drive manufacturability and yield improvements across semiconductor process domains.

Perform die-level electrical failure analysis for NAND products to identify root causes and drive yield, reliability, and quality improvements. Design and execute bench DOE and probe experiments, construct failure models, correlate circuit/layout signatures to process limitations, develop test scripts/methodologies, support NPI and HVM, and collaborate with cross-functional teams to implement corrective actions and continuous improvement, using AI-assisted tools where appropriate.

The role involves developing and maintaining test programs for HBM component validation, optimizing test strategies, coaching engineers, and ensuring the quality and stability of testing infrastructure across teams.