Top Engineering Jobs in Singapore

Owns NAND Flash memory test programs from development through production release. Develops wafer and package functional test strategies, improves yield and reliability through test optimization and data analysis, reduces test time, and ensures readiness for new product introduction and high-volume manufacturing. Collaborates with test, production, process, and engineering teams while applying programming, semiconductor, analytical, and AI-assisted problem-solving skills.

Develops, evaluates, qualifies, and deploys automated semiconductor packaging equipment. Responsibilities include defining equipment requirements, benchmarking suppliers, managing capital requests and purchasing specifications, establishing qualification criteria, transferring equipment to production, maintaining equipment maturity and capability records, enabling automation and process-control systems, and supporting supplier improvement initiatives and continuous improvement projects.

Supports High Bandwidth Memory new product introduction by integrating processes across post-wafer finishing, assembly, and test. Performs process characterization, design of experiments, yield and defect analysis, root cause investigations, and corrective actions. Tracks lots, supports readiness and manufacturing handoffs, maintains technical documentation, and collaborates with fab, assembly, test, quality, and engineering teams to resolve integration issues and meet NPI milestones.

Analyze and improve yield during High Bandwidth Memory new product introduction, from first silicon through early high-volume manufacturing. Responsibilities include yield monitoring, excursion management, defect breakdown, failure analysis coordination, yield deviation analysis, dashboard maintenance, SPC/FDC monitoring, and identifying improvement opportunities. The engineer collaborates with process integration, process engineering, manufacturing, quality, and data analysis teams while applying AI-assisted tools and data-driven problem-solving methods.

Performs electrical and physical failure analysis for semiconductor products across development and high-volume manufacturing. Investigates SBL-triggered maverick lots, analyzes test data, identifies root causes, recommends lot dispositions, and documents findings. Uses specialized laboratory tools including FIB, SEM, EDX, X-ray, EMMI, and curve tracers. Supports sample preparation, equipment maintenance, quality-system compliance, continuous improvement, and cross-functional technical projects while working required 12-hour rotating shifts.

Supports semiconductor device, package, wafer, and HBM reliability testing, failure analysis, debugging, laboratory operations, inventory, logistics, audits, safety, and continuous improvement. Uses AI-assisted tools, automation, data analysis, dashboards, and digital transformation to improve reliability operations. Requires rotating day/night shifts and collaboration with cross-functional teams, with opportunities to mentor junior technicians.

Designs, develops, tests, and validates AI-enabled solutions, workflow automation, analytics tools, and internal EHSS applications. Translates business processes into scalable technical solutions, builds prototypes and pilots, integrates APIs and enterprise platforms, and supports production deployment. Partners with EHSS, IT, data, AI, PMO, and technology teams to improve operational visibility, risk management, decision-making, governance, security, and long-term solution scalability.

Optimizes semiconductor fabrication processes, product yield, quality, reliability, cost, and productivity. Leads yield improvement, new product startups, data analysis, DOE, failure analysis, process qualifications, and cross-functional taskforces. Collaborates with wafer fab, process integration, equipment, materials, and test teams to resolve manufacturing issues and establish continuous improvement roadmaps. The role also uses AI-enabled tools responsibly to improve analysis and operational effectiveness.

Develop and optimize advanced semiconductor packaging assembly processes, including wafer-level packaging, wafer bonding, and die stacking. Evaluate equipment and materials, establish process parameters, improve yield and quality, reduce costs, and implement process controls. Collaborate across packaging, wafer fabrication, assembly, product engineering, and quality teams to transition technologies from development through high-volume manufacturing. Use statistical analysis, automation, defect analysis, and AI-enabled tools to support process improvement and production readiness.

Drives semiconductor diffusion process and equipment performance, productivity, capacity, yield, reliability, and cost improvements. Leads technical investigations, bottleneck reduction, supplier engagement, technology transfers, and cross-functional engineering projects. Uses data analytics, AI, machine learning, statistical methods, automation, and predictive maintenance approaches to improve manufacturing operations. Develops best practices, supports new capabilities, provides technical recommendations, and mentors junior engineers.