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Micron Technology

WIRE BOND PROCESS DEVELOPMENT SENIOR ENGINEER

Reposted 7 Days Ago
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Singapore
Senior level
Singapore
Senior level
Lead wire bond process development for IC packages, collaborate with global teams, and showcase innovations through publications. Responsibilities include process characterization, qualification, and technology transfer.
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Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

JR66122 WIRE BOND PROCESS DEVELOPMENT SENIOR ENGINEER

Micron Packaging R&D group is looking for highly talented individual for Wire Bond Process to develop innovative solutions for the Multi Chip Memory IC Packages.

Job Responsibilities

  • Provide leadership in wire bond technology, problem analysis and resolution
  • Develop and Transfer wire bond process for IC Package process technology (Wire Bond) for multichip memory packages
  • Process Development & Characterization, Qualification, and production pilot run
  • Work with multi-functional team to characterize new Silicon technode and develop assembly packaging/recipe solution for products requirements
  • Define, plan and implement technology roadmap to meet wire bond packaging roadmaps
  • Qualify and transfer packaging technology to production site
  • Collaborate with other functional groups both locally and globally to develop wire bond solutions to meet the packaging business needs
  • Showcase and build organization reputation by publishing technical papers and submit invention disclosures.

Job Requirements

  • PhD/Masters’s Degree in Materials, Chemical, Mechanical, Electrical & Electronic Engineering
  • At least 5 years of experience in semiconductor wire bond engineering
  • Good analytical and problem-solving skills, such as using Design Of Experiment and structured problem solving tools
  • Self-motivated, able to work independently and self-initiative personality
  • Possesses good communication skills, interpersonal skills and ability to work with global multi-functional teams

Keen on the role? Apply with us now!

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact [email protected]

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

Top Skills

Design Of Experiment
Semiconductor Engineering
Wire Bond Technology

Micron Technology Singapore Office

1 Woodlands Ind Park D St 1, Singapore, 738799

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