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Micron Technology

Snr/Staff Equipment Development Engineer (APTD)

Posted 19 Days Ago
Be an Early Applicant
In-Office
Singapore
Senior level
In-Office
Singapore
Senior level
Lead development and optimization of advanced packaging and post-probe wafer equipment, establish 5+ year hardware roadmaps, collaborate across process and quality teams, drive FOAK equipment maturation, perform data-driven controls and defect analysis, and transition new products from qualification to high-volume production.
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Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Job Description

Key responsibilities and duties include:  

  • Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking  
  • Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity
  • Establish and improve equipment management projects to deliver tech node requirements  
  • Evaluate and promote new equipment and materials to enhance process capabilities  
  • Establish hardware strategic roadmaps for 5+ years in post probe wafer and die processing  
  • Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron’s products. cost, availability, and improve hardware and process capability
  • Ensure defense coverage through process, measurement, inspection, and testing  
  • Establish correlations between defense mechanisms to identify improvement opportunities  
  • Conduct continuous data analysis to establish advanced controls and identify improvement opportunities with SMAI team
  • Good knowledge of Wafer Fab Manufacturing system, eg: MES, ETO, Autoshell and E3 FDC is preferred
  • Develop hardware roadmaps for 5+ years in post probe wafer and die processing process area
  • Collaborating with process development teams to develop innovative new solutions.
  • Performing fundamental research to drive innovative solutions for next-generation equipment products.
  • Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives  
  • Lead the equipment team to work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  
  • Lead and ensure smooth transition from new product development, qualification, small volume production to high volume production  
  • Constructs forecasts, proposals and strategic/tactical plans based on business data and market intelligence

Education and Experience.

  • B.S/M.S./Ph. D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields.
  • 5 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field stacking process equipment TC bonder/ Hybrid Bonder
  • Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred
  • Experience with Visual Basic for automation and tool integration. 
  • Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
  • Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding
  • Experience in equipment development with fundamental understanding to execute to improve equipment maturity for First of a Kind (FOAK) hardware  
  • Experience in wafer bonding, plating, warpage control and packaging process development and understanding of related inline/electrical/probe failure
  • Knowledge of semiconductor processing, solid-state device physics desirable
  • Consistent track record to solve problems and address root causes 

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.   

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact [email protected]

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.   

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Top Skills

Autoshell
Doe
E3
Eto
Fdc
Hybrid Bonder
Mes
Plating
Python
R
Recipe Management System
Rms
Spc
SQL
Tc Bonder
Visual Basic
Wafer Bonding
Warpage Control

Micron Technology Singapore, Singapore, SGP Office

1 Woodlands Ind Park D St 1, Singapore, Singapore, 738799

Micron Technology Singapore, Singapore, SGP Office

1 N Coast Dr, Singapore , Singapore, Singapore, 757432

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