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GlobalFoundries

SMTS - 3D Heterogeneous Integration (all things TSV)

Reposted 10 Days Ago
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In-Office
Singapore
Senior level
In-Office
Singapore
Senior level
GlobalFoundries is hiring a 3D Heterogeneous Integration R&D Engineer to lead TSV/TOV process development, facilitate packaging interactions, and mentor new hires while ensuring safety and quality.
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About GlobalFoundries: 

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com. 

 

Summary of Role: 

GlobalFoundries is seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer to drive TSV/TOV and post-processing (reveal, thinning, RDL, etc.) development efforts. 

 

Essential Responsibilities: 

  • Lead 3DHI process development efforts for the building blocks (‘all things TSV/TOV’) required for advanced packaging solutions needed in the product lines and planning by working with the unit process engineers, manufacturing engineers, as well as directly with the tools & materials for the GF Singapore semiconductor fabs. 

  • Drive end-to-end process integration and planning to enable new capability planning, early product prototyping and qualification across multiple programs. 

  • Develop expertise in the processes, materials and tooling leveraging available characterization resources. Develop integration schemes to continuously improve yields and to reduce cycle time & costs. 

  • Collaborate with vendors and OSATs (Outsourced Assembly and Test) to develop new wafer level and die level 2.5D and 3DHI processes.  

  • Drive understanding of failure modes.  

  • Facilitate advanced packaging interactions between the GF Singapore Product Line/Fab teams and customers. 

  • Generate IP related to novel wafer integration & packaging technology.  

 

Other Responsibilities: 

  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. 

  • Take part in hiring of other Advanced Packaging team members in Singapore. 

  • Mentor and guide new hires to assume their roles and responsibilities. 

  • Other duties as assigned by manager. 

 

Required Qualifications: 

  • Education – Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program. 

  • MS degree with at least 10 years of prior related work experience. 

  • Language Fluency - English (Written & Verbal). 

  • Travel - Up to 20%. 

 

Preferred Qualifications: 

  • Education – PhD education level preferred with at least 8 years of prior related work experience. 

  • Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.  

  • Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.   

  • Strong written and verbal communication skills.   

  • Strong planning & organizational skills. 

GlobalFoundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard.

As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.

All offers of employment with GlobalFoundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.

Information about our benefits you can find here: https://gf.com/about-us/careers/opportunities-asia

 

Top Skills

3D Heterogeneous Integration
Die Level
Semiconductor Fabrication
Tov
Tsv
Wafer Level

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