Principal / Senior Engineer, NPI - IC Assembly, Technical Operations Management

Since its spin-off in September 2025 AUMOVIO continues the business of the former Continental group sector Automotive as an independent company. The technology and electronics company offers a wide-ranging portfolio that makes mobility safe, exciting, connected, and autonomous. This includes sensor solutions, displays, braking and comfort systems as well as comprehensive expertise in software, architecture platforms, and assistance systems for software-defined vehicles. In the fiscal year 2024 the business areas, which now belong to AUMOVIO, generated sales of 19.6 billion Euro. The company is headquartered in Frankfurt, Germany and has about 87.000 employees in more than 100 locations worldwide.

We are seeking a detail-oriented and analytical NPI - IC Assembly professional to join our team in Singapore, Singapore. In this role, you will be responsible for overseeing the New Product Introduction (NPI) process for Integrated Circuit (IC) assembly, ensuring efficient and high-quality production of new semiconductor products for automotive application.

• Lead the new production introduction (NPI) for Automotive IC assembly process (e.g.: QFP, QFN, BGA) from package development to mass production at OSAT (Outsourced Semiconductor Assembly and Test).
• Coordinating with cross-functional teams to ensure smooth product launches, manufacturability and ramp-up.
• Develop and implement assembly procedures and work instructions for new products.
• Support in data exchange setup with OSAT for part traceability, quality assurance and yield monitoring.
• Monitor and optimize IC assembly processes to improve efficiency and yield. Troubleshoot assembly-related issues and drive improvement projects to meet
• Support in customer complaints events, lead root-cause analysis and corrective actions implementation at OSAT.
• Ensure compliance with quality standards and industry regulations.
• Prepare technical reports on NPI project status, risks and milestones, and presentations for management and stakeholders.
• Mentor and train junior team members on IC assembly techniques and best practices.

• Bachelor’s degree in Electronics Engineering, Electrical Engineering or related field.
• Minimum 5years of working experience in IC package assembly or OSAT management on technical topics.
• Preferable with strong proficiency in IC assembly processes or package development for automotive applications.  
• Proven experience with NPI processes in semiconductors.
• Familiarity with industry automotive standards and regulations (e.g., AEC-Q100, JEDEC. IPC standards)
• Excellent problem-solving skills and data analytical competency.
• Strong communication skills, both verbal and written (e.g., Business English, Presentations) to interact with internal and external stakeholders.
• Demonstrated ability to work effectively in a fast-paced, team-oriented environment.

Ready to take your career to the next level? The future of mobility isn’t just anyone’s job. ​Make it yours! ​Join AUMOVIO. Own What’s Next.​