The Principal Etch Process Engineer optimizes deep trench etch processes in semiconductor manufacturing, leading cross-functional collaborations to enhance yield and reliability.
We are looking for Process Engineer role in preparation for the formation of the joint venture of NXP and VIS, known as VSMC.
Job Description
This posting is for a Principal Etch Process Engineer in a high volume, 300mm wafer manufacturing environment. The Senior Deep Trench Etch Engineer is responsible for the optimization and sustaining of deep trench etch processes used in advanced semiconductor device fabrication. This role involves working with plasma etch tools driving process improvements, and collaborating with cross-functional teams to ensure high yield, reliability, and manufacturability of deep trench structures.
Primary Responsibilities:
- Develop and optimize deep trench etch processes for silicon and compound semiconductor substrates. Characterize etch profiles, selectivity, and uniformity using SEM, profilometry, and other metrology tools.
- Maintain, upgrade and monitor wafer fabrication equipment in the Etch process area. Troubleshoot process issues and implement corrective actions to improve yield and reduce defects.
- Collaborate with integration, device, Manufacturing, Maintenance, and Process teams to improve overall etch performance.
- Lead DOE (Design of Experiments) and SPC (Statistical Process Control) initiatives for process stability.
- Monitor statistical process control for high volume manufacturing equipment.
- Participate in and/or lead cross-functional and lean activity teams.
- Reduce defectivity mechanisms and improve process control
- Work with minimal supervision, balancing competing priorities, to serve the needs of the engineering and manufacturing communities
- Drive equipment performance to maximize capacity and yield performance.
- Improve cost performance of equipment.
- Mentor engineers and provide technical leadership in Etch process improvement.
Required Skills/Experience:
- B.S. Degree in Electrical Engineering, Materials Science, Solid State Physics or other relevant engineering discipline is required.
- Minimum 15 years semiconductor Etch process engineering experience is required.
- Experience in Lean Manufacturing a plus
- Knowledge of Semiconductor Manufacturing a plus
- Ability to deal with multiple issues and shifting priorities
- Strong verbal and written communication skills
- Ability to interact with multiple disciplines in a 7x24 manufacturing facility
- Good problem solving skills
- Self-motivated; able to take initiative
- Excellent interpersonal skills
- Competency in troubleshooting problems
More information about NXP in Singapore...
Top Skills
Design Of Experiments (Doe)
Plasma Etch Tools
Profilometry
Sem
Statistical Process Control (Spc)
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