Micron Technology
Package Health - Principal/Staff/Senior Engineer, Advanced Packaging Technology Development
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Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.
We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.
Job Summary
The Package Health Engineer will contribute to the development and execution of package health monitoring, simulation, and characterization activities. This role involves hands-on engineering work in DFT, data analysis, and reliability testing to ensure robust packaging solutions.
Key Responsibilities
Develop and implement DFT strategies for advanced packaging.
Conduct simulations for mechanical, thermal, and electrical performance.
Perform electrical and mechanical characterization of packages.
Analyze test and field data to identify early indicators of package degradation.
Collaborate with data scientists to build predictive models for package health.
Support root cause analysis and corrective actions for reliability issues.
Qualifications
Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or related field.
2+ years of experience in semiconductor industry (complex products preferred), preferably in packaging, test, or reliability engineering.
Hands-on experience with simulation tools and test equipment, working on package characterization, reliability testing or electrical failure analysis.
Proficiency in statistics, data analysis and scripting (e.g., Python, MATLAB, JMP).
Strong understanding of semiconductor packaging process, material interaction and properties.
Good knowledge of DRAM or ASIC product testing, test architecture, and packaging fail modes.
Additional/Preferred Qualifications
Experience with AI/ML tools or statistical modeling.
Familiarity with JEDEC or other reliability standards.
Strong problem-solving and documentation skills
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact [email protected]
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
Micron Technology Singapore, Singapore, SGP Office
1 Woodlands Ind Park D St 1, Singapore, Singapore, 738799
Micron Technology Singapore, Singapore, SGP Office
1 N Coast Dr, Singapore , Singapore, Singapore, 757432
