Lead Engineer, Package Development & Engineering

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

The PDE Pillar Lead will provide technical leadership and strategic oversight for advanced packaging initiatives within the Advanced Packaging & Technology Development organization. This role is accountable for driving technology enablement, yield acceleration, and seamless integration of next-generation packaging solutions. The Pillar Lead will establish governance frameworks, optimize development workflows, and ensure alignment with PDE’s charter to deliver cutting-edge packaging technologies.

Technical Leadership & Program Execution

• Own the full lifecycle of PDE technology pillars, including roadmap definition, execution, and closure.
• Define technical objectives, key deliverables, and resource allocation for pillar initiatives.
• Lead cross-functional engineering teams across TD, HVM, CPI, DRAM, and NPI to achieve aggressive technology milestones.

Governance & Operational Excellence

• Develop and enforce standardized methodologies for technical program management and pillar governance.
• Drive CapEx/OpEx planning, PTM and MOR processes, and integration of BOP design systems.
• Ensure compliance with internal governance models and customer technical requirements.

Strategic Alignment & Technical Communication

• Align pillar objectives with PDE’s mission to embed analytics, simulation, and advanced modeling into development workflows.
• Facilitate technical communication across BU, PDT, TPM, and central engineering teams.
• Provide leadership updates on technical progress, risks, and mitigation strategies.

Performance & Continuous Improvement

• Define and monitor KPIs for technology maturity, yield performance, and EOL accountability.
• Conduct technical reviews to validate outcomes and capture lessons learned.
• Mentor engineers and promote best practices for technical program management.

Qualifications

• Bachelor’s or Master’s degree in Engineering, Materials Science, or related technical discipline.
• 8+ years of experience in semiconductor packaging, process integration, or technology development.
• Proven ability to lead complex, cross-functional technical programs in a high-tech environment.
• Deep understanding of advanced packaging flows including hybrid bonding, CoWoS, and chiplet integration.
• Strong technical communication and leadership skills.

• Familiarity with Micron’s PDE, CPI, and NPI frameworks.
• Expertise in simulation modeling, yield enhancement, and defectivity analysis.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact [email protected]

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