Job Summary:
The SMT Assistant Process Engineer is responsible for setting up, operating, and maintaining Surface-Mount Technology (SMT) equipment used in the assembly of printed circuit boards (PCBs). This role ensures optimal line performance, product quality, and process efficiency through equipment troubleshooting, process monitoring, and continuous improvement initiatives.
Key Responsibilities:
Set up and operate SMT equipment, including stencil printers, pick-and-place machines, and reflow ovens.
Load components and materials according to BOMs and production schedules.
Perform machine calibrations and maintenance to ensure optimal performance.
Conduct first article inspection (FAI) and verify proper component placement and orientation.
Monitor solder paste quality, placement accuracy, and reflow profiles.
Troubleshoot machine errors and process defects in real-time to minimize downtime.
Conduct visual, AOI, and SPI inspections to ensure quality standards are met.
Document production issues, maintenance activities, and quality findings.
Collaborate with engineers and supervisors on process improvements and corrective actions.
Support new product introductions (NPI) and engineering change orders (ECOs).
Qualifications:
Associate degree or technical diploma in Electronics, Mechatronics, or related field preferred.
3+ years of experience in SMT manufacturing or electronics assembly.
Familiarity with SMT equipment
Understanding of PCB assembly processes and IPC-A-610 standards.
Ability to read and interpret technical documents, schematics, and BOMs.
Preferred Skills:
IPC-A-610 or J-STD-001 certification.
SMT machine programming experience (e.g., Fuji Flexa,).
Strong problem-solving and troubleshooting skills.
Basic soldering and rework capabilities.
Attention to detail and commitment to quality.
Ability to work in ESD-safe and cleanroom environments.
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