Micron Technology broke ground Tuesday on an advanced wafer fabrication facility based out of its NAND Center of Excellence in Singapore. The U.S.-headquartered semiconductor company plans to invest approximately $24 billion in the facility over 10 years to help meet long-term demand for advanced storage solutions to support AI and data-centric applications.
The facility will be Singapore’s first double-story wafer manufacturing fab, encompassing 700,000 square feet of cleanroom space, according to the company. With wafer output scheduled to start in the second half of 2028, investment in the new facility is expected to create roughly 1,600 jobs. Combined with the 1,400 jobs anticipated as a result of the $7 billion investment in an HBM advanced packaging facility the company broke ground on in January 2025, Micron plans to support approximately 3,000 new jobs in Singapore.
“This investment underscores Micron’s long-term commitment to Singapore as an important hub in our global manufacturing network, enhancing supply chain resiliency and fostering a vibrant ecosystem for innovation,” Manish Bhatia, Micron’s executive vice president of global operations, said in a statement.
